Result of search "HAL. R" (10x)

[pdf] bk 1072
Chapter H single-or double-sided with 35 {m copper plating. With option for installing connectors to DIN 41612 design C. 32- 64-an
buerklin - 391k 100%

[pdf] bk 1073
lead-free) Grid: 2.54 x 2.54 mm. Hole matrix: 34 x 54 solder lands with diameter of 2.0 mm. Option for installing connectors to DI
buerklin - 363k 100%

[pdf] bk 1074
Chapter H diameter: 1.0 mm. Substrate: laminated paper FR 2, organic surface protection (OSP) or epoxy resin FR 4, hot-tinned (HAL
buerklin - 290k 100%

[pdf] bk 1071
mm. Copper plating: both sides 35 {m, through-plated, hot-tinned (HAL lead-free) Connections: connectors DIN 41612 design C, 32- 6
buerklin - 353k 99%

[pdf] EW_613WP_ADS082186_SSS:Layout 1.qxd ew 613wp ads082186 sssx
Specifications and dimensions subject to change without notice. Consult your representative for additional options and finishes. 6
cooper - 411k 95%

[pdf] SH_FP_306_051392_SSS:Layout 1.qxd sh fp 306 051392 sssx
Specifications and dimensions subject to change without notice. Consult your representative for additional options and finishes. 3
cooper - 445k 95%

[pdf] bk 1076
Chapter H 1.0 mm. Copper plating: 35 {m. Board thickness: 1.5 mm. Type 914 with position labeling on the back side. Table index: t
buerklin - 302k 95%

[pdf] FW_506_ADS051355_SSS:Layout 1.qxd fw 506 ads051355 sssx
Specifications and dimensions subject to change without notice. Consult your representative for additional options and finishes. 5
cooper - 384k 83%

[pdf] bk 1070
Chapter H PCBs, type L 4006 for soldering, threading and wire-wrap technique. PCB size 100 x 160 mm. Contact arrangement: per left
buerklin - 304k 83%

[pdf] SH_IW_613_ADS081867_SSS:Layout 1.qxd sh iw 613 ads081867 sssx
Specifications and dimensions subject to change without notice. Consult your representative for additional options and finishes. 6
cooper - 537k 52%